Automatic Cleaning Equipment for Silicon Materials

Automated Control System
The system is controlled through a touchscreen HMI and PLC. Fully automated cleaning operations, including loading, cleaning, drying, and unloading, are performed using a servo-driven transfer cart or robotic manipulator, minimizing the risk of operator exposure to hazardous chemicals.
The control system supports timing, heating, visual and audible alarms, and allows multiple sets of process parameters to be preset for different cleaning requirements.

Multi-Stage Cleaning Process

Silicon Wafer Cleaning Process
Loading & Soaking → Ultrasonic Cleaning → Ultrasonic Acid Cleaning → Ultrasonic Rinsing → Ultrasonic Alkaline Cleaning → Ultrasonic Alkaline Cleaning → Ultrasonic Rinsing → Ultrasonic Rinsing → Ultrasonic Rinsing → Slow-Pull Dehydration → Drying → Unloading
Silicon Rod Adhesive Removal Process
By combining wet chemical cleaning technologies, such as SC-1 and SC-2 solutions,
with ultrasonic cleaning, spray rinsing, and drying processes, the system can achieve nanometer-level surface cleanliness for silicon wafers.